Yield intelligence platform
Find failing die before they cost you the wafer.
Yieldform unifies inline metrology, wafer sort, and final-test data into one live yield model — so your engineers stop hunting spreadsheets and start closing excursions.
No credit card required · Live in under 2 weeks
Live inspection · lot A7-1183
Every wafer already tells you where yield is leaking.
Yieldform reads the whole map — die by die, layer by layer — and surfaces the failing pattern in seconds, not shifts.
91.4%
Wafer yield
12
Die failing
1.8s
Scan time
edge-ring signature
M2 CMP · step 214
Trusted by yield teams at
- NORTHGATE MICRO
- AXION FAB
- CALDERA
- SILVATECH
- MERIDIAN SEMI
Platform
Everything between raw data and a defended cause.
01
Unify every data source
Merge KLARF, STDF, CSV, and tool logs into one yield model.
Every inspection tool, sorter, and tester speaks a different dialect. Yieldform normalizes it all into a single wafer-level model — no manual export, no hand-stitching.
02
Catch excursions in minutes
Real-time SPC and commonality analysis flag the tool, chamber, or step.
Control limits run continuously against live data. The moment a lot drifts, Yieldform names the exact tool, chamber, and process step in common — before the lot moves downstream.
03
Root-cause you can defend
A ranked, evidence-backed cause list — not a guess.
Every flagged excursion comes with a ranked list of correlated causes, backed by die-level evidence you can bring straight into the review.
Explore the platform
See it work on a real wafer.
Switch views the way a yield engineer would. This is live — hover the map, read the causes, watch the fab.
live · lot A7-1183
Wafer bin map · 300mm
- Bin 1 · Pass 831
- Bin 4 · Edge fail 12
Active step 214
Hover the map to inspect a die.
Ranked defect signatures · last 42 lots
n = 598 die
Ranked by number of die correlated to each defect signature across the last 42 lots.
Live fab alerts
streaming
Solutions
One platform, three ways to defend yield.
2.4pp
Yield uplift
6×
Faster root-cause
300/200mm
Coverage
E10/E58
SEMI-aligned
"Yieldform found our edge-ring excursion before it touched final test. That's a save on a lot we would've caught three steps too late."
Director of Yield Engineering, 300mm logic fab